An aerospace company developing spaceborne avionics required a custom electronics enclosure capable of surviving the extreme mechanical and thermal stresses of space launch and zero-gravity orbital operation. The enclosure needed to house multiple interconnected printed circuit board (PCB) assemblies while meeting stringent electromagnetic compatibility (EMC) standards and providing robust connector mounting for module interfacing and testing. The design demanded optimization for size, weight, and power (SWaP) constraints typical of aerospace applications, where every gram and cubic centimeter directly impacts mission viability and launch costs.
The Details
Industry
Aerospace & Defense
CAPABILITIES APPLIED
The project presented multiple interconnected mechanical, thermal, and integration challenges requiring specialized aerospace engineering expertise:
Extreme Launch Environment Survival: The enclosure needed to withstand severe vibrational loading during launch, including random vibration, sinusoidal vibration, and shock events that could compromise structural integrity, connector reliability, or PCB mounting. The design required sufficient rigidity to prevent resonance frequencies that could amplify stress on electronic components.
Thermal Management in Zero-Gravity: Unlike terrestrial electronics enclosures that can rely on convective cooling, the zero-gravity orbital environment eliminates natural air circulation. The enclosure needed passive thermal management through conductive heat transfer pathways, dissipating heat generated by high-power FPGA components on multiple PCB assemblies without active cooling systems.
Multi-Board Integration Complexity: The enclosure housed interconnected mezzanine and motherboard PCB assemblies requiring precise alignment of board-to-board connectors, mounting points, and electrical interfaces. High-density connector mating forces demanded structural support to prevent misalignment or damage during assembly and throughout the mission lifecycle.
Electromagnetic Compatibility (EMC) Requirements: Stringent EMC standards for spaceborne electronics required the enclosure to provide effective electromagnetic shielding, preventing interference between internal subsystems and external spacecraft systems while maintaining signal integrity across interconnected boards.
SWaP Optimization Constraints: Space applications impose strict limitations on size, weight, and power consumption. The enclosure design needed to minimize mass and volume while maintaining structural integrity, thermal performance, and manufacturability, as excess weight directly increases launch costs.
Design for Assembly and Manufacturability: The enclosure required a practical assembly sequence enabling efficient integration of multiple PCB assemblies, connectors, thermal management components, and protective covers. Manufacturing tolerances needed to ensure proper fit, alignment, and repeatability across production units.
Re:Build delivered a machined aluminum electronics enclosure with integrated thermal management and structural support for spaceborne deployment.
The top-down assembly architecture enabled efficient integration of mezzanine and motherboard PCB assemblies. Integrated heatsinking in the top cover, mezzanine board bottom cover, and baseplate worked with thermal gap pads to conduct heat away from high-power FPGA components.
Structural design provided rigid support for high-density connector mating forces during assembly and launch vibration. SolidWorks 3D modeling verified board alignment, mounting points, and interface compatibility before fabrication, with collaborative design review ensuring mechanical-electrical synchronization.
Post-fabrication dimensional verification confirmed aerospace tolerances. Complete assemblies were delivered for flight simulation evaluations, validating performance under simulated launch and orbital conditions.
